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Request a Quote on Heat Sinks Products Like Boyd (Formerly Aavid) Part Number 374324B60023G Now!

Mfg Part Number : 374324B60023G
Manufacturer : Boyd (Formerly Aavid)
Main Category : Thermal Management
Category : Heat Sinks
Sub Category : Fpga And Bga Heat Sinks
Description : Boyd 374324b60023g - 10mm Height, 27mm Length, 27mm Width - Solder Anchor Heat Sink (Requires 2 Anchors)

ElectroMech Purchasing is a premier procurement platform for those seeking reliable parts, our website’s vast inventory featuring over 2 billion new, used, obsolete, and hard-to-find items that are readily available at any time. You are currently on the RFQ form for part number 374324B60023G, a Boyd (Formerly Aavid) item listed with the description “Boyd 374324b60023g - 10mm Height, 27mm Length, 27mm Width - Solder Anchor Heat Sink (Requires 2 Anchors)” If part number 374324B60023G is of interest to you, be sure to use our online RFQ service to request a quote, and we guarantee you will receive a response within 15 minutes upon our receipt and review of a completed form.

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Here at ElectroMech Purchasing, we take pride in offering some of the best Heat Sinks products on the market, doing all within our power to meet and exceed industry standards for quality control and export compliance. More than that, we rigorously follow a NO CHINA SOURCING pledge, further guaranteeing the authenticity and reliability of our Boyd 374324b60023g - 10mm Height, 27mm Length, 27mm Width - Solder Anchor Heat Sink (Requires 2 Anchors) items. If you happen to be facing a time constraint where you require electromechanical parts quickly, rest assured that we can offer expedited shipping options based on availability. Bearing this in mind, kick off procurement for part number 374324B60023G and other Boyd (Formerly Aavid) products today.

Product Characteristics of 374324B60023G

Attachment Method Solder Anchor
Base Product Number 374324
Category Fans, Thermal Management, Thermal, Heat Sinks
Diameter -
Fin Height 0.394 (10.00mm)
Material Finish Black Anodized
Mfr Aavid, Thermal Division of Boyd Corporation
Package Cooled BGA, FPGA
Power Dissipation @ Temperature Rise 1.5W @ 50?C
Product Status Active
Shape Square, Pin Fins
Thermal Resistance @ Forced Air Flow 6.00?C/W @ 500 LFM
Thermal Resistance @ Natural 30.60°C/W
Type Board Level

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